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Meticulous Research®—a leading global market research company, published a research report titled, ‘Semiconductor Manufacturing Equipment Market, by Front-end Equipment (Silicon Wafer Manufacturing, Wafer Fabrication), Back-end Equipment (Testing, Assembling & Packaging), Dimension, Component, End User, and Geography - Global Forecast to 2030’.
According to this latest publication from Meticulous Research®, the global semiconductor manufacturing equipment market is projected to register a CAGR of 6% in 2024–2030, to reach $171.6 billion by 2030. The growth of this market is driven by rapid technological advancements coupled with consumers' increasing acceptance of connected devices, rising demand for semiconductors and the resultant proliferation of fabrication facilities, and increasing utilization of semiconductors in EV manufacturing. However, the growing adoption of 5g technology and increasing acceptance of autonomous vehicles is a major trend in the global semiconductor manufacturing equipment market. Supply chain disruptions caused by the COVID-19 pandemic may restrain the market to a certain extent. Moreover, the development of user-friendly and easy-to-integrate designs is a challenge for market growth. Government initiatives aimed at boosting the semiconductors industry and the growing use of connected devices in home automation are expected to offer significant opportunities for the growth of this market.
The global semiconductor manufacturing equipment market is segmented by type, dimension, component, and end user. The study also evaluates industry competitors and analyzes the market at the regional and country levels.
Based on type, the global semiconductor manufacturing equipment market is broadly segmented into front-end equipment and back-end equipment. Front-end equipment is further segmented into silicon wafer manufacturing equipment, wafer fabrication equipment, and other front-end equipment. Back-end Equipment is further segmented into testing equipment, assembling & packaging equipment, and other back-end equipment. In 2022, the front-end equipment segment accounted for the larger share of the global semiconductor manufacturing equipment market. This segment is also expected to register the highest CAGR during the forecast period. The large market share of this segment is attributed to the growing consumer electronics market and the increasing number of foundries, rising demand for electric and hybrid vehicles, and the need to streamline production, improve yield and reliability, and minimize design and manufacturing errors.
Based on dimension, the global semiconductor manufacturing equipment market is segmented into 2D, 2.5D, and 3D. In 2022, the 3D segment accounted for the largest share of the global semiconductor manufacturing equipment market. This segment is also expected to register the highest CAGR during the forecast period. The large market share of this segment is mainly attributed to the increasing need to automate required design steps, the growing demand for improved functionalities and miniaturization of portable hand-held devices, the need for rapid prototyping, and the rising need to deliver better products in a shorter amount of time.
Based on component, the global semiconductor manufacturing equipment market is segmented into memory, logic, analog, microprocessing units (MPUs), optical devices, discrete devices, microcontroller units (MCUs), sensors, and digital signal processors (DSPs). In 2022, the memory segment accounted for the largest share of the global semiconductor manufacturing equipment market. This segment is also expected to register the highest CAGR during the forecast period. The large market share of this segment is attributed to the increasing use of memory devices in the automotive sector for infotainment & navigation systems and advanced safety devices, decreasing prices of memory devices; and increasing consumption of memory in electronics devices, rising investment in various research & development activities for the development of existing and forthcoming memory devices to increase efficiency.
Based on end user, the global semiconductor manufacturing equipment market is segmented into integrated device manufacturers (IDMs), foundries, and outsourced semiconductor assembly & test (OSAT). In 2022, the integrated device manufacturers segment accounted for the largest share of the global semiconductor manufacturing equipment market. This segment is also expected to register the highest CAGR during the forecast period. The large market share of this segment is attributed to the significant presence of IDMs in the market, the increasing consumption of consumer electronics devices, and the growing need to provide design and foundry services to other semiconductor companies.
Based on geography, the global semiconductor manufacturing equipment market is segmented into North America, Europe, Asia-Pacific, Latin America, and the Middle East & Africa. In 2022, Asia-Pacific accounted for the largest share of the global semiconductor manufacturing equipment market, followed by Europe and North America. The region is also expected to witness rapid growth during the forecast period. The large market share of Asia-Pacific is mainly attributed to the rising demand for semiconductor manufacturing equipment, rapid growth in automotive and industrial electronics, the proliferation of IoT devices, the presence of major players in Taiwan and China, increasing need for high-quality processing equipment for semiconductive materials, and increasing government initiatives to support semiconductor industries.
Key Players:
The key players operating in the semiconductor manufacturing equipment market are Tokyo Electron Limited (Japan), Lam Research Corporation (U.S.), SCREEN Holdings Co., Ltd. (Japan), Teradyne, Inc. (U.S.), Advantest Corporation (Japan), Hitachi High-Tech Corporation (Japan), Applied Materials, Inc. (U.S.), KLA Corporation (U.S.), Plasma-Therm (U.S.), ASML (Netherlands), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Ferrotec Holdings Corporation (Japan), Canon Machinery Inc. (Japan), Veeco Instruments Inc. (U.S.), Onto Innovation Inc. (U.S.), Nordson Corporation (U.S.), and Tokyo Seimitsu Co., Ltd. (Japan).
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Key questions answered in the report-
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