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Redding, California - September 11, 2025

Printed Circuit Board Assembly Market to be Worth $147.4 Billion by 2035

Printed Circuit Board Assembly (PCBA) Market Size, Share & Forecast 2025-2035 | Growth Analysis by Assembly Type, Component Type, Application, End-User & Geography


Meticulous Research®—a leading global market research company, published a research report titled 'Printed Circuit Board Assembly (PCBA) Market Size, Share, Forecast, & Trends Analysis by Assembly Type (Surface Mount Technology, Through-Hole Technology, Mixed Technology), Component Type (Active Components, Passive Components, Electromagnetic Components), Application (Consumer Electronics, Automotive, Telecommunications, Medical Devices), End-User (OEMs, EMS Providers, ODMs), Geography (North America, Europe, Asia-Pacific, Latin America, Middle East & Africa) — Global Forecast to 2035'

According to this latest publication from Meticulous Research®, the printed circuit board assembly market is projected to reach $147.4 billion by 2035, at a CAGR of 4.9% from 2025 to 2035. The expansion of this market is primarily driven by the escalating demand for consumer electronics and smart devices, rapid growth in automotive electronics and electric vehicle adoption, increasing deployment of IoT and connected device ecosystems, accelerated 5G network infrastructure development, and rising requirements for medical electronics and healthcare devices. Additionally, the ongoing trend toward miniaturization requiring sophisticated assembly technologies, expansion of industrial automation and Industry 4.0 implementations, and growing demand for wearable and flexible electronics are expected to create substantial growth opportunities for market participants.

The key players operating in the printed circuit board assembly market are Hon Hai Precision Industry Co., Ltd. (Taiwan), Flex Ltd. (Singapore), Jabil Inc. (U.S.), Sanmina Corporation (U.S.), Celestica Inc. (Canada), Benchmark Electronics, Inc. (U.S.), Plexus Corp. (U.S.), Kimball Electronics, Inc. (U.S.), Creation Technologies LP (Canada), Nortech Systems, Inc. (U.S.), Key Tronic Corporation (U.S.), Universal Scientific Industrial Co., Ltd. (Taiwan), Shenzhen Kaifa Technology Co., Ltd. (China), EuroCircuits NV (Belgium), Seeed Technology Co., Ltd. (China), Vexos Corporation (U.S.), Tempo Automation, Inc. (U.S.), PCBWay (China), WellPCB Technology Co., Ltd. (China), and TTM Technologies, Inc. (U.S.).

The printed circuit board assembly market study presents historical market data value (2023 and 2024), estimated current data (2025), and forecasts for 2035. This market is segmented by assembly type, component type, application, end-user, and geography.

Among all the assembly types, the Surface Mount Technology (SMT) segment is expected to account for the largest share of the printed circuit board assembly market in 2025. The dominant position of this segment is primarily attributed to its exceptional component density capabilities, seamless compatibility with automated assembly processes, and superior cost-effectiveness for high-volume manufacturing operations. SMT technology enables manufacturers to achieve compact designs while maintaining high reliability and performance standards across diverse electronic applications.

Among all the component types, the active components segment is expected to account for the largest share of the printed circuit board assembly market in 2025, primarily due to the proliferation of semiconductors, microprocessors, and integrated circuits in modern electronic devices. Active components serve as the functional backbone of electronic systems, enabling signal amplification, computational processing, power management, and logic operations essential for device functionality.

Among all the applications, the consumer electronics segment is projected to hold the largest share of the printed circuit board assembly market in 2025. This segment's dominance stems from massive global production volumes and continuous innovation cycles in devices such as smartphones, laptops, tablets, wearable technology, gaming systems, and smart home products. The segment benefits from high worldwide adoption rates, frequent product upgrade cycles, and integration of increasingly sophisticated features.

Among all the end-users, the Electronics Manufacturing Services (EMS) segment is projected to register significant growth during the forecast period. The robust growth of this segment is driven by the widespread outsourcing trend among electronics companies, specialized assembly capabilities offered by contract manufacturers, and cost advantages provided by offshore manufacturing operations. EMS providers offer comprehensive solutions spanning design support, component procurement, assembly services, and testing capabilities.

However, the medical devices segment is witnessing the fastest growth among applications, driven by rising healthcare demands, aging global demographics, and increasing integration of electronics in diagnostic, monitoring, and therapeutic equipment. Medical devices such as portable patient monitoring systems, advanced imaging equipment, precision infusion devices, and implantable electronics require specialized PCBAs designed to meet stringent regulatory standards and safety requirements.

Among all the geographies, the Asia-Pacific region is also projected to register the highest CAGR during the forecast period of 2025–2035. This accelerated growth is driven by factors such as established electronics manufacturing ecosystems, competitive cost structures, presence of major contract manufacturing facilities, continued capacity expansion initiatives, increasing domestic electronics demand, and substantial investments in 5G infrastructure development. Countries including China, Japan, South Korea, and Taiwan continue to lead global electronics production capabilities.

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Key Questions Answered in the Report:

  • What is the current revenue generated by the printed circuit board assembly market globally?
  • At what rate is the printed circuit board assembly market demand projected to grow for the next 10 years?
  • What are the historical market sizes and growth rates of the printed circuit board assembly market?
  • What are the major factors impacting the growth of this market at the regional and country levels? What are the major opportunities for existing players and new entrants in the market?
  • Which segments in terms of assembly type, component type, application, and end-user are expected to create major traction for the manufacturers in this market?
  • What are the key geographical trends in this market? Which regions/countries are expected to offer significant growth opportunities for the manufacturers operating in the printed circuit board assembly market?
  • Who are the major players in the printed circuit board assembly market? What are their specific product offerings in this market?
  • What are the recent strategic developments in the printed circuit board assembly market? What are the impacts of these strategic developments on the market?

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